Disclosed is a chemical vapor deposition apparatus for equalizing a heating temperature, which maintains the heating temperature of a heater provided therein uniform not only on the lower surface of the heater but also on the upper surface thereof, so that a thin film having a uniform thickness is deposited on a wafer. In order to maintain the heating temperature of the heater of the chemical vapor deposition apparatus uniform, the chemical vapor deposition apparatus includes a thermal insulation reflecting plate for reflecting heat from the lower surface of the heater and a heat dissipation member disposed between the thermal insulation reflecting plate and the heater to be in direct contact with the area of the heater having a high temperature, or includes a heat dissipation member mounted underneath the area of the heater having a high temperature. Also, the apparatus includes a depression having a predetermined shape in the surface of the area of the heater having a relatively high temperature coming into direct contact with a wafer, and further includes a heat dissipation member disposed between the thermal insulation reflecting plate and the heater to be in contact with the area of the heater having a high temperature to thus decrease reflected heat, thereby equalizing the temperatures of the upper and lower surfaces of the heater.