Invention Grant
- Patent Title: Electrode assembly
- Patent Title (中): 电极组件
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Application No.: US13435897Application Date: 2012-03-30
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Publication No.: US08877026B2Publication Date: 2014-11-04
- Inventor: Hisashi Yamanouchi , Hiromi Ohkawa , Koji Ueda
- Applicant: Hisashi Yamanouchi , Hiromi Ohkawa , Koji Ueda
- Applicant Address: JP
- Assignee: Horiba, Ltd.
- Current Assignee: Horiba, Ltd.
- Current Assignee Address: JP
- Agency: Cantor Colburn LLP
- Priority: JP2011-081080 20110331
- Main IPC: G01N27/333
- IPC: G01N27/333 ; G01N27/403 ; G01N27/28 ; G01N27/414

Abstract:
The electrode assembly is provided with: a rod-like body 1 that extends along a predetermined axis; a substrate that is formed with a through-hole penetrating between a front surface and a back surface and attached to a fore end part of the body; and a sensor chip for electrochemical measurement, which is attached on the back surface of the substrate such that a sensing part is exposed outside from the through-hole, wherein: on the back surface of the substrate, a wiring for obtaining an output signal from the ISFET chip is formed, and the sensor chip is attached to the wiring directly or closely; and the substrate is attached with being inclined with respect to the predetermined axis of the body, and thereby the front surface of the substrate forms at least a part of a fore end surface that is inclined with respect to the predetermined axis.
Public/Granted literature
- US20120247955A1 ELECTRODE ASSEMBLY Public/Granted day:2012-10-04
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