Invention Grant
US08877077B2 Method for producing thin, free-standing layers of solid state materials with structured surfaces
有权
用于生产具有结构化表面的薄的,独立的固态材料层的方法
- Patent Title: Method for producing thin, free-standing layers of solid state materials with structured surfaces
- Patent Title (中): 用于生产具有结构化表面的薄的,独立的固态材料层的方法
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Application No.: US13141821Application Date: 2009-12-18
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Publication No.: US08877077B2Publication Date: 2014-11-04
- Inventor: Lukas Lichtensteiger
- Applicant: Lukas Lichtensteiger
- Applicant Address: DE
- Assignee: Siltectra GmbH
- Current Assignee: Siltectra GmbH
- Current Assignee Address: DE
- Agency: Brooks Kushman P.C.
- International Application: PCT/EP2009/067539 WO 20091218
- International Announcement: WO2010/072675 WO 20100701
- Main IPC: B44C1/22
- IPC: B44C1/22

Abstract:
A method of printing comprises the steps of: providing a solid state material having an exposed surface; applying an auxiliary layer to the exposed surface to form a composite structure, the auxiliary layer having a stress pattern; subjecting the composite structure to conditions facilitating fracture of the solid state material along a plane at a depth therein; and removing the auxiliary layer and, therewith, a layer of the solid state material terminating at the fracture depth, wherein an exposed surface of the removed layer of solid state material has a surface topology corresponding to the stress pattern.
Public/Granted literature
- US20110259936A1 METHOD FOR PRODUCING THIN, FREE-STANDING LAYERS OF SOLID STATE MATERIALS WITH STRUCTURED SURFACES Public/Granted day:2011-10-27
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