Invention Grant
US08877077B2 Method for producing thin, free-standing layers of solid state materials with structured surfaces 有权
用于生产具有结构化表面的薄的,独立的固态材料层的方法

  • Patent Title: Method for producing thin, free-standing layers of solid state materials with structured surfaces
  • Patent Title (中): 用于生产具有结构化表面的薄的,独立的固态材料层的方法
  • Application No.: US13141821
    Application Date: 2009-12-18
  • Publication No.: US08877077B2
    Publication Date: 2014-11-04
  • Inventor: Lukas Lichtensteiger
  • Applicant: Lukas Lichtensteiger
  • Applicant Address: DE
  • Assignee: Siltectra GmbH
  • Current Assignee: Siltectra GmbH
  • Current Assignee Address: DE
  • Agency: Brooks Kushman P.C.
  • International Application: PCT/EP2009/067539 WO 20091218
  • International Announcement: WO2010/072675 WO 20100701
  • Main IPC: B44C1/22
  • IPC: B44C1/22
Method for producing thin, free-standing layers of solid state materials with structured surfaces
Abstract:
A method of printing comprises the steps of: providing a solid state material having an exposed surface; applying an auxiliary layer to the exposed surface to form a composite structure, the auxiliary layer having a stress pattern; subjecting the composite structure to conditions facilitating fracture of the solid state material along a plane at a depth therein; and removing the auxiliary layer and, therewith, a layer of the solid state material terminating at the fracture depth, wherein an exposed surface of the removed layer of solid state material has a surface topology corresponding to the stress pattern.
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