Invention Grant
- Patent Title: Modular fabrication systems and methods
- Patent Title (中): 模块化制造系统和方法
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Application No.: US14146179Application Date: 2014-01-02
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Publication No.: US08877112B2Publication Date: 2014-11-04
- Inventor: Lawrence Bonassar , Hod Lipson , Daniel L. Cohen , Evan Malone
- Applicant: Cornell Research Foundation, Inc.
- Applicant Address: US NY Ithaca
- Assignee: Cornell Research Foundation, Inc.
- Current Assignee: Cornell Research Foundation, Inc.
- Current Assignee Address: US NY Ithaca
- Agency: LeClairRyan, a Professional Corporation
- Main IPC: B28B1/14
- IPC: B28B1/14 ; B29C67/00 ; A61L27/36
Abstract:
The present invention relates to an article fabrication system having a plurality of material deposition tools containing one or more materials useful in fabricating the article, and a material deposition device having a tool interface for receiving one of the material deposition tools. A system controller is operably connected to the material deposition device to control operation of the material deposition device. Also disclosed is a method of fabricating an article using the system of the invention and a method of fabricating a living three-dimensional structure.
Public/Granted literature
- US20140117586A1 MODULAR FABRICATION SYSTEMS AND METHODS Public/Granted day:2014-05-01
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