Invention Grant
US08877114B2 Method for removing a SMP apparatus from a cured composite part 有权
从固化的复合部件中去除SMP装置的方法

Method for removing a SMP apparatus from a cured composite part
Abstract:
A method and apparatus for removing a SMP apparatus from within a cured composite part. The method may comprise the steps of triggering the SMP apparatus from a rigid state to a malleable state, inducing a pressure differential that drives the SMP apparatus, in the malleable state, away from the cured composite part and toward an inner mandrel tool, and removing the inner mandrel tool with the SMP apparatus resting thereon out of the cured composite part. The inner mandrel tool may comprise an outer surface having varying contours such that a surface area of the outer surface is great enough to prevent the SMP apparatus from folding over onto itself or creasing when driven toward the inner mandrel tool. A maximum straight line distance between points on the outer surface may be small enough to allow the inner mandrel tool clearance for removal from the cured composite part.
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