Invention Grant
- Patent Title: Injection blow molding system with enhanced parison temperature control
- Patent Title (中): 注塑吹塑系统,增强型坯温度控制
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Application No.: US12951882Application Date: 2010-11-22
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Publication No.: US08877117B2Publication Date: 2014-11-04
- Inventor: Randal L. Fields , Bruce A. Wardlow , David A. Brunson
- Applicant: Randal L. Fields , Bruce A. Wardlow , David A. Brunson
- Applicant Address: US MO Lee's Summit
- Assignee: R&D Tool & Engineering Co.
- Current Assignee: R&D Tool & Engineering Co.
- Current Assignee Address: US MO Lee's Summit
- Agency: Hovey Williams LLP
- Main IPC: B29C49/06
- IPC: B29C49/06

Abstract:
An injection blow molding (IBM) system and method for consistently maintaining the surface temperature of the parison molds within a desired range. Implementation of this system/method can result in more consistent production of higher quality parisons and molded articles. Additionally, this system/method reduces the discretion required by the IBM operator and shifts the burden of consistently making high-quality parisons and molded articles onto the designer of the IBM tooling.
Public/Granted literature
- US20120126462A1 INJECTION BLOW MOLDING SYSTEM WITH ENHANCED PARISON TEMPERATURE CONTROL Public/Granted day:2012-05-24
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