Invention Grant
- Patent Title: Positive resist composition and pattern-forming method
- Patent Title (中): 正抗蚀剂组成和图案形成方法
-
Application No.: US12058055Application Date: 2008-03-28
-
Publication No.: US08877421B2Publication Date: 2014-11-04
- Inventor: Shinichi Kanna
- Applicant: Shinichi Kanna
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-085989 20070328; JP2008-071482 20080319
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/075 ; G03F7/20 ; G03F7/30

Abstract:
A positive resist composition includes: (A) a resin capable of increasing the solubility in an alkali developing solution by the action of an acid, including: (a1) a repeating unit selected from repeating units represented by following formulae (a1-1) to (a1-3); (a2) a repeating unit represented by a following formula (a2); and (a3) a repeating unit selected from repeating units represented by following formulae (a3-1) to (a3-4); (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom, and being insoluble in an alkali developing solution; and (D) a solvent, wherein the formulae above are defined in the specification.
Public/Granted literature
- US20080248420A1 POSITIVE RESIST COMPOSITION AND PATTERN-FORMING METHOD Public/Granted day:2008-10-09
Information query
IPC分类: