Invention Grant
- Patent Title: Process for producing liquid ejection head
- Patent Title (中): 液体喷射头的制造方法
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Application No.: US14146197Application Date: 2014-01-02
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Publication No.: US08877431B2Publication Date: 2014-11-04
- Inventor: Takuma Kodoi , Chiaki Muraoka , Keiji Tomizawa
- Applicant: Canon Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2013-003559 20130111
- Main IPC: G03F7/20
- IPC: G03F7/20 ; B41J2/16

Abstract:
A process for producing a liquid ejection head by providing, in one chip, a liquid ejection head having a portion for ejection in which an ejection orifice array is arranged and a side portion having no ejection orifice array, these portions being provided with a member of a photosensitive material, arranging the chip on a common substrate in such a chip array that these two portions are alternately arranged, and separating each chip from the substrate, the process including the steps of relatively moving a reticle of an aligner along the chip array for a photosensitive material on the substrate to expose each chip, and developing the material to obtain the member. A first reticle for forming the portion for ejection and a second reticle for forming only the side portion are used. The exposure includes a first and a second exposure treatment respectively by the first and second reticles.
Public/Granted literature
- US20140199633A1 PROCESS FOR PRODUCING LIQUID EJECTION HEAD Public/Granted day:2014-07-17
Information query
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