Invention Grant
US08877569B2 Method of manufacturing thin film transistor with oxide semiconductor using sputtering method
有权
使用溅射法制造具有氧化物半导体的薄膜晶体管的方法
- Patent Title: Method of manufacturing thin film transistor with oxide semiconductor using sputtering method
- Patent Title (中): 使用溅射法制造具有氧化物半导体的薄膜晶体管的方法
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Application No.: US13455425Application Date: 2012-04-25
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Publication No.: US08877569B2Publication Date: 2014-11-04
- Inventor: Yoshiaki Oikawa , Hotaka Maruyama , Hiromichi Godo , Daisuke Kawae , Shunpei Yamazaki
- Applicant: Yoshiaki Oikawa , Hotaka Maruyama , Hiromichi Godo , Daisuke Kawae , Shunpei Yamazaki
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2009-026482 20090206
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/44 ; H01L29/786 ; H01L27/12 ; H01L21/02

Abstract:
An object is to provide a semiconductor device provided with a thin film transistor having excellent electric characteristics using an oxide semiconductor layer. An In—Sn—O-based oxide semiconductor layer including SiOX is used for a channel formation region. In order to reduce contact resistance between the In—Sn—O-based oxide semiconductor layer including SiOX and a wiring layer formed from a metal material having low electric resistance, a source region or drain region is formed between a source electrode layer or drain electrode layer and the In—Sn—O-based oxide semiconductor layer including SiOX. The source region or drain region and a pixel region are formed using an In—Sn—O-based oxide semiconductor layer which does not include SiOX.
Public/Granted literature
- US20120214276A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE Public/Granted day:2012-08-23
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