Invention Grant
US08877591B2 Methods of manufacturing vertical structure nonvolatile memory devices
有权
制造垂直结构非易失性存储器件的方法
- Patent Title: Methods of manufacturing vertical structure nonvolatile memory devices
- Patent Title (中): 制造垂直结构非易失性存储器件的方法
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Application No.: US14092191Application Date: 2013-11-27
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Publication No.: US08877591B2Publication Date: 2014-11-04
- Inventor: Byeong-in Choe , Sung-il Chang , Chang-seok Kang , Jin-soo Lim
- Applicant: Byeong-in Choe , Sung-il Chang , Chang-seok Kang , Jin-soo Lim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2010-0052366 20100603
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/78 ; G11C16/04 ; H01L29/66 ; H01L29/792 ; H01L27/115 ; H01L29/788

Abstract:
A vertical structure nonvolatile memory device can include a channel layer that extends in a vertical direction on a substrate. A memory cell string includes a plurality of transistors that are disposed on the substrate in the vertical direction along a vertical sidewall of the channel layer. At least one of the plurality of transistors includes at least one recess in a gate of the transistor into which at least one protrusion, which includes the channel layer, extends.
Public/Granted literature
- US20140087534A1 METHODS OF MANUFACTURING VERTICAL STRUCTURE NONVOLATILE MEMORY DEVICES Public/Granted day:2014-03-27
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