Invention Grant
- Patent Title: Devices with crack stops
- Patent Title (中): 破裂装置
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Application No.: US13715260Application Date: 2012-12-14
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Publication No.: US08877611B2Publication Date: 2014-11-04
- Inventor: Van Allen Mieczkowski , Daniel James Namishia
- Applicant: Cree, Inc.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agent Robert S. Pyles
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L23/00 ; H01L23/58 ; H01L21/683
Abstract:
An apparatus that comprises a device on a substrate and a crack stop in the substrate. Methods of forming a device are also disclosed. The methods may include providing a device, such as a semiconductor device, on a substrate having a first thickness, reducing the thickness of the substrate to a second thickness, and providing a crack stop in the substrate. Reducing the thickness of the substrate may include mounting the substrate to a carrier substrate for support and then removing the carrier substrate. The crack stop may prevent a crack from reaching the device.
Public/Granted literature
- US20130189829A1 DEVICES WITH CRACK STOPS Public/Granted day:2013-07-25
Information query
IPC分类:
