Cleaning solution and damascene process using the same

Invention Grant

US08877640B2 Cleaning solution and damascene process using the same 有权

Title translation: 清洗液和镶嵌工艺使用相同

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Patent Title: Cleaning solution and damascene process using the same
Patent Title (中): 清洗液和镶嵌工艺使用相同
Application No.: US13848068

Application Date: 2013-03-21
Publication No.: US08877640B2

Publication Date: 2014-11-04
Inventor: An-Chi Liu , Tien-Cheng Lan , Kuei-Hsuan Yu
Applicant: United Microelectronics Corporation
Applicant Address: TW Hsinchu
Assignee: United Microelectronics Corporation
Current Assignee: United Microelectronics Corporation
Current Assignee Address: TW Hsinchu
Agent Ding Yu Tan
Main IPC: H01L21/44
IPC: H01L21/44 ; C11D3/34 ; C11D7/34 ; C11D3/395 ; C11D1/37 ; C11D7/32 ; C11D3/28 ; C11D3/39 ; C11D7/50 ; C11D7/26 ; C11D3/43 ; H01L21/02 ; C11D11/00 ; C11D3/04 ; H01L21/768 ; C11D3/20 ; C11D3/30

Cleaning solution and damascene process using the same

Abstract:

A cleaning solution is provided. The cleaning solution includes an aliphatic polycarboxylic acid, a chain sulfonic acid substantially less than 4 wt % and an amine containing buffer agent.

Abstract(Chinese):

提供清洁液。清洁溶液包括脂族多元羧酸，基本上小于4重量％的链磺酸和含胺缓冲剂。

Public/Granted literature

US20130217234A1 CLEANING SOLUTION AND DAMASCENE PROCESS USING THE SAME Public/Granted day:2013-08-22

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/44	....用H01L21/36至H01L21/428各组不包含的方法或设备在半导体材料上制造电极的