Invention Grant
US08877645B2 Integrated circuit structure having selectively formed metal cap
有权
具有选择性地形成的金属盖的集成电路结构
- Patent Title: Integrated circuit structure having selectively formed metal cap
- Patent Title (中): 具有选择性地形成的金属盖的集成电路结构
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Application No.: US13233064Application Date: 2011-09-15
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Publication No.: US08877645B2Publication Date: 2014-11-04
- Inventor: Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
- Applicant: Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Yuanmin Cai
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/48 ; H01L29/78

Abstract:
Methods of forming an integrated circuit structure utilizing a selectively formed and at least partially oxidized metal cap over a gate, and associated structures. In one embodiment, a method includes providing a precursor structure including a transistor having a metal gate; forming an etch stop layer over an exposed portion of the metal gate; at least partially oxidizing the etch stop layer; and forming a dielectric layer over the at least partially oxidized etch stop layer.
Public/Granted literature
- US20130069161A1 INTEGRATED CIRCUIT STRUCTURE HAVING SELECTIVELY FORMED METAL CAP Public/Granted day:2013-03-21
Information query
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