Invention Grant
- Patent Title: Substrate structure and method of manufacturing the same
-
Application No.: US14146233Application Date: 2014-01-02
-
Publication No.: US08877652B2Publication Date: 2014-11-04
- Inventor: Jun-youn Kim , Su-hee Chae , Hyun-gi Hong , Young-jo Tak
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce
- Priority: KR10-2010-0064872 20100706
- Main IPC: H01L33/12
- IPC: H01L33/12 ; H01L21/02 ; H01L33/00 ; H01S5/00 ; H01S5/02 ; H01S5/323
Abstract:
A substrate structure and method of manufacturing the same are disclosed. The substrate structure may includes a substrate on which a plurality of protrusions are formed on one surface thereof and a plurality of buffer layers formed according to a predetermined pattern and formed spaced apart from each other on the plurality of protrusions.
Public/Granted literature
- US20140113437A1 SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-04-24
Information query
IPC分类:
