Provided is an adhesive resin composition having improved heat resistance without deteriorations in adhesive strength and flexibility. The adhesive resin composition comprises 30 to 98 wt % of an ethylene/vinyl acetate copolymer (a) and 70 to 2 wt % of a propylene resin composition (P), wherein the total of the component (a) and the component (P) is 100 wt %. The propylene resin composition (P) comprises 60 to 0 wt % of a propylene polymer (b) having a melting point of 120 to 170° C. and a melt flow rate of 0.1 to 500 g/10 min, and 40 to 100 wt % of a propylene polymer (c) having a melting point of less than 120° C. or showing no melting points and having a melt flow rate of 0.1 to 500 g/10 min, wherein the total of the component (b) and the component (c) is 100 wt %.