Invention Grant
- Patent Title: Hot melt adhesive comprising cyanoacrylate curing compounds
- Patent Title (中): 包含氰基丙烯酸酯固化化合物的热熔粘合剂
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Application No.: US13777337Application Date: 2013-02-26
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Publication No.: US08877868B2Publication Date: 2014-11-04
- Inventor: Marcus Heemann , Charles W. Paul , Maria Xenidou , Maja Schroeder , Sebastian Kostyra , Marisa Phelan
- Applicant: Henkel AG & Co. KGaA , Henkel Corporation , Henkel Ireland Limited
- Applicant Address: DE Duesseldorf US CT Rocky Hill
- Assignee: Henkel IP & Holding GmbH,Henkel US IP LLC
- Current Assignee: Henkel IP & Holding GmbH,Henkel US IP LLC
- Current Assignee Address: DE Duesseldorf US CT Rocky Hill
- Agent Steven C. Bauman
- Main IPC: C09J4/06
- IPC: C09J4/06 ; C09J125/02 ; C09J131/04 ; C09J133/06 ; C09J125/16 ; C09J133/12 ; C09J123/00

Abstract:
A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl (meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.
Public/Granted literature
- US20140238603A1 HOT MELT ADHESIVE COMPRISING CYANOACRYLATE CURING COMPOUNDS Public/Granted day:2014-08-28
Information query
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