Invention Grant
- Patent Title: Integrated device with defined heat flow
- Patent Title (中): 具有定义热流的集成设备
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Application No.: US13352151Application Date: 2012-01-17
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Publication No.: US08878071B2Publication Date: 2014-11-04
- Inventor: Thomas Brunschwiler , Jens Hofrichter
- Applicant: Thomas Brunschwiler , Jens Hofrichter
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstadt, Ellenbogen & Kammer, LLP
- Agent Jennifer R. Davis
- Priority: EP11151543 20110120
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02
Abstract:
An integrated device includes at least one heat generating component which generates heat when operated, at least one temperature-sensitive component, and one or more hollow insulation regions arranged between the at least one heat generating component and the at least one temperature-sensitive component. The hollow insulation region may be provided as a vacuum gap.
Public/Granted literature
- US20120186793A1 INTEGRATED DEVICE WITH DEFINED HEAT FLOW Public/Granted day:2012-07-26
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