Invention Grant
- Patent Title: Printed circuit board and methods of manufacturing the same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US13526186Application Date: 2012-06-18
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Publication No.: US08878073B2Publication Date: 2014-11-04
- Inventor: Philip W. Johnson
- Applicant: Philip W. Johnson
- Applicant Address: US WI Beloit
- Assignee: Regal Beloit America, Inc.
- Current Assignee: Regal Beloit America, Inc.
- Current Assignee Address: US WI Beloit
- Agency: Armstrong Teasdale LLP
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K3/30 ; H05K1/11

Abstract:
A printed circuit board is provided. The printed circuit board includes a base having a top and a bottom. The top has a first circuit area, a second circuit area and a slotted area disposed between the first circuit area and the second circuit area. The slotted area includes a first row of a plurality of first slots, each first slot of the plurality of first slots has a first length and is separated from an adjacent first slot by a first space. The slotted area includes a second row of a plurality of second slots that is positioned parallel with respect to the first row. Each second slot of the plurality of second slots has a second length that is different than the first length and is separated from an adjacent second slot by a second space. The second space includes a different length than the first space.
Public/Granted literature
- US20130333932A1 PRINTED CIRCUIT BOARD AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2013-12-19
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