Invention Grant

  • Patent Title: Electro-magnetic interface termination structures and systems and methods for making the same
  • Patent Title (中): 电磁接口端接结构及其制造方法
  • Application No.: US13346096
    Application Date: 2012-01-09
  • Publication No.: US08878079B2
    Publication Date: 2014-11-04
  • Inventor: Ian P. Colahan
  • Applicant: Ian P. Colahan
  • Applicant Address: US CA Cupertino
  • Assignee: Apple Inc.
  • Current Assignee: Apple Inc.
  • Current Assignee Address: US CA Cupertino
  • Agency: Van Court & Aldridge LLP
  • Main IPC: H05K9/00
  • IPC: H05K9/00 H01R43/00
Electro-magnetic interface termination structures and systems and methods for making the same
Abstract:
Compact, high-speed data cable structures that include shielding to protect from electro-magnetic interference (EMI) are disclosed. The cable structures can include the conductors necessary to communicate signals that comply with the HDMI™ standard. The cable structures are formed for use with portable electronic devices and may include specific connectors, such as the 30 pin connector found on many products, such as the iPhone™ from Apple Inc. The cable structures include a micro crimp that enables the cable to be smaller than traditional high-speed data cables. The cable structures also include a shield body housing formed from a pair of virtually identical halves that are mated together to form the housing.
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