Invention Grant
- Patent Title: Light emitting diode module and method for manufacturing the same
- Patent Title (中): 发光二极管模块及其制造方法
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Application No.: US13558015Application Date: 2012-07-25
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Publication No.: US08878216B2Publication Date: 2014-11-04
- Inventor: Jae Sung You
- Applicant: Jae Sung You
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0074223 20110726
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/76 ; H01L21/00 ; H01L33/48 ; H01L33/54
Abstract:
A light emitting diode (LED) module includes a substrate, an LED disposed on the substrate, a phosphor layer disposed on the LED, and a lens disposed on the substrate. The substrate has a recess defined therein. The lens is fastened to the substrate through the recess. A manufacturing method for the LED includes forming the recess in the substrate, mounting the LED on the substrate, forming the phosphor layer on the LED, and forming the lens directly on the substrate such that the lens is fastened to the substrate through the recess.
Public/Granted literature
- US20130049047A1 LIGHT EMITTING DIODE MODULE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-02-28
Information query
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