Invention Grant
US08878229B2 Light emitting device package including a substrate having at least two recessed surfaces
有权
发光器件封装，其包括具有至少两个凹入表面的衬底
- Patent Title: Light emitting device package including a substrate having at least two recessed surfaces
- Patent Title (中): 发光器件封装，其包括具有至少两个凹入表面的衬底
-
Application No.: US14021577Application Date: 2013-09-09
-
Publication No.: US08878229B2Publication Date: 2014-11-04
- Inventor: Guen-Ho Kim , Yu Ho Won
- Applicant: LG Innotek Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2008-0048241 20080523
- Main IPC: H01L29/22
- IPC: H01L29/22 ; H01L33/00 ; H01L29/227 ; H01L23/02 ; H01L23/48 ; H01L23/04 ; H01L23/52 ; H01L29/40 ; H01L33/62 ; H01L33/48 ; H01L33/60 ; H01L33/50
Abstract:
Disclosed is a light emitting device package. The light emitting device package includes a substrate including a recess, a light emitting chip on the substrate and a first conductive layer electrically connected to the light emitting chip. And the first conductive layer includes at least one metal layer electrically connected to the light emitting chip on an outer circumference of the substrate.
Public/Granted literature
- US20140008696A1 LIGHT EMITTING DEVICE PACKAGE INCLUDING A SUBSTRATE HAVING AT LEAST TWO RECESSED SURFACES Public/Granted day:2014-01-09
Information query
IPC分类:
