Invention Grant
- Patent Title: High electron mobility transistors and methods of fabricating the same
- Patent Title (中): 高电子迁移率晶体管及其制造方法
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Application No.: US13151475Application Date: 2011-06-02
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Publication No.: US08878246B2Publication Date: 2014-11-04
- Inventor: In-jun Hwang , Jai-kwang Shin , Jae-joon Oh , Jong-seob Kim , Hyuk-soon Choi , Ki-ha Hong
- Applicant: In-jun Hwang , Jai-kwang Shin , Jae-joon Oh , Jong-seob Kim , Hyuk-soon Choi , Ki-ha Hong
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2010-0056192 20100614
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/778 ; H01L29/267 ; H01L29/51 ; H01L29/10 ; H01L29/20 ; H01L29/423

Abstract:
A High electron mobility transistor (HEMT) includes a source electrode, a gate electrode, a drain electrode, a channel forming layer in which a two-dimensional electron gas (2DEG) channel is induced, and a channel supplying layer for inducing the 2DEG channel in the channel forming layer. The source electrode and the drain electrode are located on the channel supplying layer. A channel increase layer is between the channel supplying layer and the source and drain electrodes. A thickness of the channel supplying layer is less than about 15 nm.
Public/Granted literature
- US20110303952A1 High Electron Mobility Transistors And Methods Of Fabricating The Same Public/Granted day:2011-12-15
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