Invention Grant
- Patent Title: Semiconductor device and fabrication method
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US13544023Application Date: 2012-07-09
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Publication No.: US08878248B2Publication Date: 2014-11-04
- Inventor: Tetsuro Ishiguro , Atsushi Yamada
- Applicant: Tetsuro Ishiguro , Atsushi Yamada
- Applicant Address: JP Yokoham
- Assignee: Transphorm Japan, Inc.
- Current Assignee: Transphorm Japan, Inc.
- Current Assignee Address: JP Yokoham
- Agency: Fish & Richardson P.C.
- Priority: JP2011-213472 20110928
- Main IPC: H01L31/0328
- IPC: H01L31/0328 ; H01L31/0336 ; H01L31/072 ; H01L31/109 ; H01L29/778 ; H01L29/66 ; H01L29/10 ; H01L29/20

Abstract:
A semiconductor device includes a first semiconductor layer formed on a substrate, the first semiconductor containing an impurity element; a second semiconductor layer formed on the first semiconductor layer; a third semiconductor layer formed on the second semiconductor layer; and a gate electrode, a source electrode and a drain electrode that are formed on the third semiconductor layer. In the semiconductor device, the second semiconductor layer includes an impurity diffusion region in which an impurity element contained in the first semiconductor layer is diffused, the impurity diffusion region being located directly beneath the gate electrode and being in contact with the first semiconductor layer, and the impurity element causes the impurity diffusion region to be a p-type impurity diffusion region.
Public/Granted literature
- US20130075785A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD Public/Granted day:2013-03-28
Information query
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