Invention Grant
US08878285B2 Vertical semiconductor device, module and system each including the same, and method for manufacturing the vertical semiconductor device 有权
每个包括它们的垂直半导体器件,模块和系统以及用于制造垂直半导体器件的方法

  • Patent Title: Vertical semiconductor device, module and system each including the same, and method for manufacturing the vertical semiconductor device
  • Patent Title (中): 每个包括它们的垂直半导体器件,模块和系统以及用于制造垂直半导体器件的方法
  • Application No.: US13719090
    Application Date: 2012-12-18
  • Publication No.: US08878285B2
    Publication Date: 2014-11-04
  • Inventor: Seong Wan RyuMin Soo Yoo
  • Applicant: SK Hynix Inc.
  • Applicant Address: KR Icheon
  • Assignee: SK Hynix Inc.
  • Current Assignee: SK Hynix Inc.
  • Current Assignee Address: KR Icheon
  • Priority: KR10-2012-0077259 20120716
  • Main IPC: H01L29/66
  • IPC: H01L29/66 H01L29/78 H01L27/108 H01L29/10 H01L29/06
Vertical semiconductor device, module and system each including the same, and method for manufacturing the vertical semiconductor device
Abstract:
A vertical semiconductor device having a vertical channel region is disclosed. The vertical semiconductor device includes a pillar having a vertical channel region, a bit line buried in a semiconductor substrate located at a lower part of the pillar, and a body connection unit configured to couple at least one sidewall of the pillar to the semiconductor substrate. As a result, the floating body effect of the vertical semiconductor device can be more effectively removed.
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