Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13446026Application Date: 2012-04-13
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Publication No.: US08878288B2Publication Date: 2014-11-04
- Inventor: Atsuo Isobe , Toshinari Sasaki
- Applicant: Atsuo Isobe , Toshinari Sasaki
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2011-096163 20110422
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/786 ; H01L29/423

Abstract:
To provide a highly reliable semiconductor device. To provide a semiconductor device which prevents a defect and achieves miniaturization. An oxide semiconductor layer in which the thickness of a region serving as a source region or a drain region is larger than the thickness of a region serving as a channel formation region is formed in contact with an insulating layer including a trench. In a transistor including the oxide semiconductor layer, variation in threshold voltage, degradation of electric characteristics, and shift to normally on can be suppressed and source resistance or drain resistance can be reduced, so that the transistor can have high reliability.
Public/Granted literature
- US20120267709A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-10-25
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