Invention Grant
US08878335B2 Method and system for providing fusing after packaging of semiconductor devices
有权
用于在半导体器件封装之后提供熔化的方法和系统
- Patent Title: Method and system for providing fusing after packaging of semiconductor devices
- Patent Title (中): 用于在半导体器件封装之后提供熔化的方法和系统
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Application No.: US12977104Application Date: 2010-12-23
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Publication No.: US08878335B2Publication Date: 2014-11-04
- Inventor: Thorsten Meyer , Josef Boeck , Rudolf Lachner , Herbert Schaefer
- Applicant: Thorsten Meyer , Josef Boeck , Rudolf Lachner , Herbert Schaefer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L23/525 ; H01L21/66
Abstract:
A method and a system for providing fusing after packaging of semiconductor devices are disclosed. In one embodiment, a semiconductor device is provided comprising a substrate comprising a fuse area, at least one fuse disposed in the fuse area, and at least one layer disposed over the substrate, wherein the at least one layer comprises at least one opening exposing the at least one fuse.
Public/Granted literature
- US20120161278A1 METHOD AND SYSTEM FOR PROVIDING FUSING AFTER PACKAGING OF SEMICONDUCTOR DEVICES Public/Granted day:2012-06-28
Information query
IPC分类:
