Invention Grant
- Patent Title: Capacitor for interposers and methods of manufacture thereof
- Patent Title (中): 插入体用电容器及其制造方法
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Application No.: US13485340Application Date: 2012-05-31
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Publication No.: US08878338B2Publication Date: 2014-11-04
- Inventor: Chun Hua Chang , Der-Chyang Yeh , Kuang-Wei Cheng , Yuan-Hung Liu , Shang-Yun Hou , Wen-Chih Chiou , Shin-Puu Jeng
- Applicant: Chun Hua Chang , Der-Chyang Yeh , Kuang-Wei Cheng , Yuan-Hung Liu , Shang-Yun Hou , Wen-Chih Chiou , Shin-Puu Jeng
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L21/02 ; H01L29/02
Abstract:
Capacitor designs for substrates, such as interposers, and methods of manufacture thereof are disclosed. A through via is formed in the interposer, and a capacitor is formed between a lower level metallization layer and a higher level metallization layer. The capacitor may be, for example, a planar capacitor with dual capacitor dielectric layers.
Public/Granted literature
- US20130320493A1 CAPACITOR FOR INTERPOSERS AND METHODS OF MANUFACTURE THEREOF Public/Granted day:2013-12-05
Information query
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