Invention Grant
- Patent Title: Semiconductor device with an integrated poly-diode
- Patent Title (中): 具有集成多极二极管的半导体器件
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Application No.: US13849825Application Date: 2013-03-25
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Publication No.: US08878343B2Publication Date: 2014-11-04
- Inventor: Franz Hirler , Anton Mauder , Frank Pfirsch , Hans-Joachim Schulze
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/739 ; H01L29/10 ; H01L29/417 ; H01L29/06 ; H01L29/45 ; H01L29/49

Abstract:
A field effect semiconductor device includes a semiconductor body having a main horizontal surface and a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type arranged between the first semiconductor region and the main horizontal surface, an insulating layer arranged on the main horizontal surface, and a first metallization arranged on the insulating layer. The first and second semiconductor regions form a pn-junction. The semiconductor body further has a deep trench extending from the main horizontal surface vertically below the pn-junction and including a conductive region insulated from the first semiconductor region and the second semiconductor region, and a narrow trench including a polycrystalline semiconductor region extending from the first metallization, through the insulating layer and at least to the conductive region. A vertical poly-diode structure including a horizontally extending pn-junction is arranged at least partly in the narrow trench.
Public/Granted literature
- US20130299835A1 Semiconductor Device with an Integrated Poly-Diode Public/Granted day:2013-11-14
Information query
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