Invention Grant
US08878349B2 Semiconductor chip and stacked semiconductor package having the same
有权
半导体芯片和具有相同的堆叠半导体封装
- Patent Title: Semiconductor chip and stacked semiconductor package having the same
- Patent Title (中): 半导体芯片和具有相同的堆叠半导体封装
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Application No.: US13586309Application Date: 2012-08-15
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Publication No.: US08878349B2Publication Date: 2014-11-04
- Inventor: Gyu Jei Lee , Kang Won Lee , Hyun Joo Kim
- Applicant: Gyu Jei Lee , Kang Won Lee , Hyun Joo Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2012-0026494 20120315
- Main IPC: H01L23/20
- IPC: H01L23/20
Abstract:
A semiconductor chip includes a semiconductor substrate having one surface, an other surface which faces away from the one surface, and through holes which pass through the one surface and the other surface; through electrodes filled in the through holes; and a gettering layer formed of polysilicon interposed between the through electrodes and inner surfaces of the semiconductor substrate whose form is defined by the through holes.
Public/Granted literature
- US20130241078A1 SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME Public/Granted day:2013-09-19
Information query
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