Invention Grant
- Patent Title: Package structure having micro-electro-mechanical system element and method of fabrication the same
- Patent Title (中): 具有微机电系统元件的封装结构及其制造方法
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Application No.: US13660200Application Date: 2012-10-25
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Publication No.: US08878356B2Publication Date: 2014-11-04
- Inventor: Hong-Da Chang , Cheng-Hsiang Liu , Kuang-Wei Huang , Chun-Hung Lin , Hsin-Yi Liao
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Edwards Wildman Palmer LLP
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW101122366A 20120622
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/22 ; H01L23/24 ; H01L23/051 ; H01L23/053 ; H01L23/043
Abstract:
A package structure is provided, including: a substrate having a ground pad and an MEMS element; a lid disposed on the substrate for covering the MEMS element; a wire segment electrically connected to the ground pad; an encapsulant encapsulating the lid and the wire segment; and a circuit layer formed on the encapsulant and electrically connected to the wire segment and the lid so as to commonly ground the substrate and the lid, thereby releasing accumulated electric charges on the lid so as to improve the reliability of the MEMS system and reduce the number of I/O connections.
Public/Granted literature
- US20130341739A1 PACKAGE STRUCTURE HAVING MICRO-ELECTRO-MECHANICAL SYSTEM ELEMENT AND METHOD OF FABRICATION THE SAME Public/Granted day:2013-12-26
Information query
IPC分类:
