Invention Grant
- Patent Title: Electronic component device, method of manufacturing the same and wiring substrate
- Patent Title (中): 电子部件装置及其制造方法以及配线基板
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Application No.: US13221064Application Date: 2011-08-30
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Publication No.: US08878357B2Publication Date: 2014-11-04
- Inventor: Yuichi Taguchi , Akinori Shiraishi , Mitsutoshi Higashi
- Applicant: Yuichi Taguchi , Akinori Shiraishi , Mitsutoshi Higashi
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2010-229309 20101012
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L21/50 ; H01L21/683 ; H01L23/10 ; B81B7/00 ; H01L23/055 ; H01L23/00 ; H01L23/13
Abstract:
An electronic component device includes a substrate, an electrode post made of a metal material, provide to stand on the substrate, and an electronic component whose connection electrode is connected to the electrode post, wherein the connection electrode of the electronic component and the electrode post are joined by an alloy layer including a metal which is different from the metal material of the electrode post.
Public/Granted literature
- US20120086116A1 ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING THE SAME AND WIRING SUBSTRATE Public/Granted day:2012-04-12
Information query
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