Invention Grant
- Patent Title: Leadless package system having external contacts
- Patent Title (中): 无引线封装系统具有外部触点
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Application No.: US13195973Application Date: 2011-08-02
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Publication No.: US08878361B2Publication Date: 2014-11-04
- Inventor: Byung Tai Do , Linda Pei Ee Chua , Heap Hoe Kuan
- Applicant: Byung Tai Do , Linda Pei Ee Chua , Heap Hoe Kuan
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/28 ; H01L23/31 ; H01L23/48 ; H01L21/683 ; H01L21/56 ; H01L23/00 ; H01L21/48
Abstract:
A leadless package system includes: an integrated circuit die having contact pads; external contact terminals with a conductive layer and an external coating layer; connections between contact pads in the integrated circuit die and the external contact terminals; and an encapsulant encapsulates the integrated circuit die and the external contact terminals including the external coating layer.
Public/Granted literature
- US20110285002A1 LEADLESS PACKAGE SYSTEM HAVING EXTERNAL CONTACTS Public/Granted day:2011-11-24
Information query
IPC分类:
