Invention Grant
US08878368B2 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
有权
芯片载体基板上的刚性波纹图案设计和半导体和电子子系统封装的印刷电路板
- Patent Title: Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
- Patent Title (中): 芯片载体基板上的刚性波纹图案设计和半导体和电子子系统封装的印刷电路板
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Application No.: US13941823Application Date: 2013-07-15
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Publication No.: US08878368B2Publication Date: 2014-11-04
- Inventor: Chin-Tien Chiu , Chih-Chin Liao , Ken Jian Ming Wang , Han-Shiao Chen , Cheeman Yu , Hem Takiar
- Applicant: SanDisk Technologies Inc.
- Applicant Address: US TX Plano
- Assignee: SanDisk Technologies Inc.
- Current Assignee: SanDisk Technologies Inc.
- Current Assignee Address: US TX Plano
- Agency: Vierra Magen Marcus LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00 ; H01L23/31 ; H01L23/498 ; H01L23/00
Abstract:
A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
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