Invention Grant
US08878435B2 Remote thermal compensation assembly 有权
远程热补偿组件

Remote thermal compensation assembly
Abstract:
A thermal compensating circuit board (TCB) assembly comprising a substrate, the substrate comprising at least one thermal compensating circuit deposited thereon, the substrate devoid of a solid state emitter, and at least one electrical connector coupled to the at least one thermal compensating circuit, the connector configured to couple with a solid state emitter assembly and/or power supply. Lighting devices comprising the TCB assembly are provided.
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