Invention Grant
- Patent Title: Remote thermal compensation assembly
- Patent Title (中): 远程热补偿组件
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Application No.: US13358938Application Date: 2012-01-26
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Publication No.: US08878435B2Publication Date: 2014-11-04
- Inventor: Randy Demuynck , Curt Progl
- Applicant: Randy Demuynck , Curt Progl
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Moore & Van Allen PLLC
- Agent Christopher J. Knors
- Main IPC: H01J17/28
- IPC: H01J17/28

Abstract:
A thermal compensating circuit board (TCB) assembly comprising a substrate, the substrate comprising at least one thermal compensating circuit deposited thereon, the substrate devoid of a solid state emitter, and at least one electrical connector coupled to the at least one thermal compensating circuit, the connector configured to couple with a solid state emitter assembly and/or power supply. Lighting devices comprising the TCB assembly are provided.
Public/Granted literature
- US20130193850A1 REMOTE THERMAL COMPENSATION ASSEMBLY Public/Granted day:2013-08-01
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