Invention Grant
- Patent Title: Multilayered ceramic capacitor and mounting structure of circuit board having multilayered ceramic capacitor mounted thereon
- Patent Title (中): 多层陶瓷电容器和安装有多层陶瓷电容器的电路板的安装结构
-
Application No.: US13770962Application Date: 2013-02-19
-
Publication No.: US08879235B2Publication Date: 2014-11-04
- Inventor: Young Ghyu Ahn , Heung Kil Park , Doo Young Kim , Sang Soo Park , Min Cheol Park
- Applicant: Samsung Electro-Mechanics, Co., Ltd.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0136771 20121129
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/005 ; H01G4/06 ; H01G4/12 ; H05K1/16

Abstract:
There is provided a multilayered ceramic capacitor, including a ceramic body, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body while having the dielectric layer therebetween, to form capacitance; upper and lower cover layers formed above and below the active layer; first and second external electrodes covering both end surfaces of the ceramic body; a plurality of first and second dummy electrodes extended from the first and second external electrodes; and a plurality of piezoelectric members connecting the first internal electrode and the first dummy electrode or the second internal electrode and the second dummy electrode, inside the active layer, the piezoelectric members having a higher dielectric constant than the dielectric layer.
Public/Granted literature
Information query