Invention Grant
- Patent Title: Heat transfer system
- Patent Title (中): 传热系统
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Application No.: US13568968Application Date: 2012-08-07
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Publication No.: US08879260B2Publication Date: 2014-11-04
- Inventor: Sven Kalms , Christian Weiss
- Applicant: Sven Kalms , Christian Weiss
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agency: Patterson & Sheridan, LLP
- Priority: DE102007045733 20070925
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H01L23/427 ; F28F7/00 ; H01L23/34 ; H01R13/62
Abstract:
The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
Public/Granted literature
- US20120314363A1 HEAT TRANSFER SYSTEM Public/Granted day:2012-12-13
Information query
