Invention Grant
- Patent Title: Electronic circuit storage case and manufacturing method thereof
- Patent Title (中): 电子电路储存盒及其制造方法
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Application No.: US13268077Application Date: 2011-10-07
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Publication No.: US08879265B2Publication Date: 2014-11-04
- Inventor: Naoyuki Kishikawa , Hiroyuki Uramachi
- Applicant: Naoyuki Kishikawa , Hiroyuki Uramachi
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-100985 20110428
- Main IPC: H01G9/10
- IPC: H01G9/10 ; H05K5/06 ; H05K5/00 ; H05K7/00 ; G06F1/16 ; H01J5/00 ; H01J15/00 ; H01R13/66

Abstract:
An electronic circuit storage case includes a housing made of resin and having a case portion storing an electronic circuit board and a connector portion extending in a direction perpendicular to a board attachment surface of the case portion and incorporating a connector. Interior and exterior opening holes communicate at bottoms via a communication hole. A ventilating hole continuing from the interior of the case portion to the exterior of the connector portion is provided in a solid portion of the housing. The interior opening hole and the communication hole are bent in an L shape and provided to a primary resin mold part forming the housing. The exterior opening hole is provided to a secondary resin mold part of the housing enclosing the primary resin mold part and forming the connector and case portions so as to communicate with one end of the L-shaped communication hole substantially perpendicularly.
Public/Granted literature
- US20120273388A1 ELECTRONIC CIRCUIT STORAGE CASE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-11-01
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