Invention Grant
- Patent Title: Cooling system for an electronic rack
- Patent Title (中): 电子机架的冷却系统
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Application No.: US13371497Application Date: 2012-02-13
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Publication No.: US08879268B2Publication Date: 2014-11-04
- Inventor: Shih-Chang Lee , Chi-Hao Jin , Ming-Lee Chu , Chih-Hsun Lin
- Applicant: Shih-Chang Lee , Chi-Hao Jin , Ming-Lee Chu , Chih-Hsun Lin
- Applicant Address: TW Taipei
- Assignee: Academia Sinica
- Current Assignee: Academia Sinica
- Current Assignee Address: TW Taipei
- Agency: Bacon & Thomas, PLLC
- Priority: TW100205840U 20110401
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.
Public/Granted literature
- US20120250259A1 COOLING SYSTEM FOR AN ELECTRONIC RACK Public/Granted day:2012-10-04
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