Invention Grant
- Patent Title: Anti-corrosion conformal coating comprising modified porous silica fillers for metal conductors electrically connecting an electronic component
- Patent Title (中): 防腐保形涂层包括用于电连接电子部件的金属导体的改性多孔二氧化硅填料
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Application No.: US13401028Application Date: 2012-02-21
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Publication No.: US08879275B2Publication Date: 2014-11-04
- Inventor: Dylan J. Boday , Joseph Kuczynski , Jason T. Wertz , Jing Zhang
- Applicant: Dylan J. Boday , Joseph Kuczynski , Jason T. Wertz , Jing Zhang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Robert R. Williams
- Main IPC: H05K7/00
- IPC: H05K7/00 ; B32B33/00 ; B32B3/02 ; D03D27/00 ; D04H11/00 ; D05C17/00
Abstract:
A conformal coating comprising modified porous silica particles is disclosed. A porous silica particle, such as MCM-14 or SBA-15 is modified with a sulfur gettering functionality, such as a phosphine compound, covalently bonded to silicon atoms in the porous silica particle. The conformal coating comprising the modified porous silica particles may be applied to metallic wiring areas of a circuit component, with the sulfur gettering functionality preventing sulfur from atmospheric gasses from penetrating the conformal coating to the metallic wiring.
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