Invention Grant
- Patent Title: Memory system and method using stacked memory device dice
- Patent Title (中): 内存系统和方法使用堆叠式存储设备芯片
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Application No.: US13684260Application Date: 2012-11-23
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Publication No.: US08879296B2Publication Date: 2014-11-04
- Inventor: Byoung Jin Choi
- Applicant: Conversant Intellectual Property Management Inc.
- Applicant Address: CA Ottawa, Ontario
- Assignee: Conversant Intellectual Property Management Inc.
- Current Assignee: Conversant Intellectual Property Management Inc.
- Current Assignee Address: CA Ottawa, Ontario
- Agency: Borden Ladner Gervais LLP
- Agent Shin Hung
- Main IPC: G11C5/06
- IPC: G11C5/06 ; G11C29/02 ; G11C7/10 ; G11C11/4097

Abstract:
A method and apparatus for organizing memory for a computer system including a plurality of memory devices 2, 3, connected to a logic device 1, particularly a memory system having a plurality of stacked memory dice connected to a logic die, with the logic device 1 having capability to analyze and compensate for differing delays to the stacked devices 2,3,4,5 stacking multiple dice divided into partitions serviced by multiple buses 21,22 connected to a logic die 1, to increase throughput between the devices 2,3 and logic 1 device allowing large scale integration of memory with self-healing capability.
Public/Granted literature
- US20130135917A1 MEMORY SYSTEM AND METHOD USING STACKED MEMORY DEVICE DICE Public/Granted day:2013-05-30
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