Invention Grant
- Patent Title: Communication circuit and semiconductor device
- Patent Title (中): 通信电路和半导体器件
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Application No.: US13914499Application Date: 2013-06-10
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Publication No.: US08879645B2Publication Date: 2014-11-04
- Inventor: Shigeyuki Okabe
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2012-143698 20120627
- Main IPC: H04B3/00
- IPC: H04B3/00 ; H04L25/00 ; H04B1/10 ; H03K19/003

Abstract:
A communication circuit includes a receiver circuit that provides differential communication by using first and second transmission paths which transmit first and second signals. The receiver circuit includes a compensation circuit that compensates for the attenuation of a current when common mode noise is superimposed on the first signal and on the second signal. The compensation circuit includes a first compensation circuit and a second compensation circuit. The first compensation circuit detects an electric current attenuation of the first signal when the common mode noise is superimposed thereon, and compensates for the attenuation thereof by adding the detected electric current attenuation to the second signal. The second compensation circuit detects an electric current attenuation of the second signal when the common mode noise is superimposed thereon, and compensates for the attenuation thereof by adding the detected electric current attenuation to the first signal.
Public/Granted literature
- US20140003562A1 COMMUNICATION CIRCUIT AND SEMICONDUCTOR DEVICE Public/Granted day:2014-01-02
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