Invention Grant
- Patent Title: Defect inspecting device and defect inspecting method
- Patent Title (中): 缺陷检查装置和缺陷检查方法
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Application No.: US13520479Application Date: 2010-12-27
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Publication No.: US08879821B2Publication Date: 2014-11-04
- Inventor: Kei Shimura
- Applicant: Kei Shimura
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Brundidge & Stanger, P.C.
- Priority: JP2010-012362 20100122
- International Application: PCT/JP2010/073558 WO 20101227
- International Announcement: WO2011/089829 WO 20110728
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G01N21/956 ; G01N21/95

Abstract:
The present invention provides a defect inspection system which enables an improvement in the efficiency of spatial filter settings, and at the same time enables automation of the spatial filter settings. An adjustable field-of-view diaphragm is narrowed to obtain an image of a spatial filter surface by use of an observation camera, and pixels of the image are classified into a plurality of groups according to the brightness level of bright spots of diffracted light. A spatial filter is set in such a manner that a group, the brightness level of which is highest, is light-shielded, and an observation image is then captured. Whether or not a repetitive pattern remains in the captured image is determined, and when it is determined that a repetitive pattern remains, the settings of the spatial filter are changed. The spatial filter is set in such a manner that in addition to the group which has been light-shielded earlier, a group, the brightness level of which is the highest next to the light-shielded group, can also be light-shielded. The same step is repeated until it is determined that no repetitive pattern remains. The settings of the spatial filter then end.
Public/Granted literature
- US20130011043A1 DEFECT INSPECTING DEVICE AND DEFECT INSPECTING METHOD Public/Granted day:2013-01-10
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