Invention Grant
US08880227B2 Component temperature control by coolant flow control and heater duty cycle control
有权
组件温度控制由冷却液流量控制和加热器占空比控制
- Patent Title: Component temperature control by coolant flow control and heater duty cycle control
- Patent Title (中): 组件温度控制由冷却液流量控制和加热器占空比控制
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Application No.: US13040149Application Date: 2011-03-03
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Publication No.: US08880227B2Publication Date: 2014-11-04
- Inventor: Chetan Mahadeswaraswamy , Kartik Ramaswamy , Bryan Liao , Sergio Shoji , Duy D. Nguyen , Hamid Noorbakhsh , David Palagashvili
- Applicant: Chetan Mahadeswaraswamy , Kartik Ramaswamy , Bryan Liao , Sergio Shoji , Duy D. Nguyen , Hamid Noorbakhsh , David Palagashvili
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman, LLP
- Main IPC: G06F19/00
- IPC: G06F19/00 ; H01J37/32 ; H01L21/67

Abstract:
Methods and systems for controlling temperatures in plasma processing chamber for a wide range of setpoint temperatures and reduced energy consumption. Temperature control is coordinated between a coolant liquid loop and a heat source by a control algorithm implemented by the plasma processing module controller. The control algorithm may completely stop the flow of coolant liquid to a temperature-controlled component in response to a feedback signal indicating an actual temperature is below the setpoint temperature. The control algorithm may further be based at least in part on a feedforward control signal derived from a plasma power or change in plasma power input into the processing chamber during process recipe execution.
Public/Granted literature
- US20120048467A1 COMPONENT TEMPERATURE CONTROL BY COOLANT FLOW CONTROL AND HEATER DUTY CYCLE CONTROL Public/Granted day:2012-03-01
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