Invention Grant
- Patent Title: Method for circuit simulation
- Patent Title (中): 电路仿真方法
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Application No.: US13158718Application Date: 2011-06-13
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Publication No.: US08880386B2Publication Date: 2014-11-04
- Inventor: An-Yu Kuo , Xin Al
- Applicant: An-Yu Kuo , Xin Al
- Applicant Address: US CA Campbell
- Assignee: Sigrity, Inc.
- Current Assignee: Sigrity, Inc.
- Current Assignee Address: US CA Campbell
- Agency: Kenyon & Kenyon LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A computer-implemented method for simulating an electrical circuit. The method includes (a) setting a first temperature distribution in the electrical circuit, (b) performing an electrical simulation across the electrical circuit taking into consideration the first temperature distribution, (c) performing a thermal simulation across the electrical circuit taking into consideration a result of the electrical simulation, to obtain a second temperature distribution, and (d) determining whether a criterion for termination the simulation is met. If the criterion is met, terminate the simulation. If the criterion is not met, assign the second temperature distribution to the first temperature distribution, and repeat steps (b), (c), and (d).
Public/Granted literature
- US20120316857A1 Method for Circuit Simulation Public/Granted day:2012-12-13
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