Invention Grant
- Patent Title: Hot-plugging of multi-core processor
- Patent Title (中): 多核处理器的热插拔
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Application No.: US13396617Application Date: 2012-02-15
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Publication No.: US08880924B2Publication Date: 2014-11-04
- Inventor: Je-Myoung Ko , Boo-Jin Kim
- Applicant: Je-Myoung Ko , Boo-Jin Kim
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2011-0014863 20110221
- Main IPC: G06F1/32
- IPC: G06F1/32

Abstract:
A method of hot-plugging a multi-core processor includes monitoring respective workload levels of multiple processor cores, hot-plugging off a first core among the processor cores upon determining that its workload level has fallen below a lower reference value, and hot-plugging on a second core among the processor cores upon determining that its workload level has risen above an upper reference value while the first core is hot-plugged off.
Public/Granted literature
- US20120216064A1 HOT-PLUGGING OF MULTI-CORE PROCESSOR Public/Granted day:2012-08-23
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