Invention Grant
- Patent Title: Reducing impact of a repair action in a switch fabric
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Application No.: US13177611Application Date: 2011-07-07
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Publication No.: US08880937B2Publication Date: 2014-11-04
- Inventor: William J. Armstrong , John M. Borkenhagen , Martin J. Crippen , Dhruv M. Desai , David R. Engebretsen , Philip R. Hillier, III , William G. Holland , James E. Hughes , Bradley D. McCredie , James A. O'Connor , Steven M. Tri
- Applicant: William J. Armstrong , John M. Borkenhagen , Martin J. Crippen , Dhruv M. Desai , David R. Engebretsen , Philip R. Hillier, III , William G. Holland , James E. Hughes , Bradley D. McCredie , James A. O'Connor , Steven M. Tri
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Patterson & Sheridan LLP
- Main IPC: G06F11/00
- IPC: G06F11/00 ; G06F11/07 ; G06F11/32 ; G06F11/10 ; G06F11/20

Abstract:
Techniques are disclosed for reducing impact of a repair action in a switch fabric. In one embodiment, a server system is provided that includes a first interposer card that operatively connects one or more server cards to a midplane. The first interposer card may include a switch module that switches network traffic for the one or more server cards. The first interposer card may be hot-swappable from the midplane, and the one or more server cards may be hot-swappable from the first interposer card.
Public/Granted literature
- US20130013956A1 REDUCING IMPACT OF A REPAIR ACTION IN A SWITCH FABRIC Public/Granted day:2013-01-10
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