A polishing mechanism includes a support base, a pair of magnetic valves, a first polishing assembly and a second polishing assembly. The pair of magnetic valves are mounted in the support base. The first polishing assembly and the second polishing assembly are mounted on the support base and connected to the pair of magnetic valves respectively. The second polishing assembly is arranged perpendicular to the first polishing assembly. The first and the second polishing assemblies are respectively controlled by the pair of magnetic valves to polish one or more workpieces. The present disclosure further discloses a manipulator using the polishing mechanism.