Invention Grant
- Patent Title: Fast repair of a bundled link interface using packet replication
- Patent Title (中): 使用数据包复制快速修复捆绑链接接口
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Application No.: US13310748Application Date: 2011-12-03
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Publication No.: US08885462B2Publication Date: 2014-11-11
- Inventor: Shamit Dipak Kapadia , Zhifang Zeng
- Applicant: Shamit Dipak Kapadia , Zhifang Zeng
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: The Law Office of Kirk D. Williams
- Main IPC: H04J3/14
- IPC: H04J3/14 ; G06F11/00 ; H04L12/28 ; H04L12/56 ; G06F15/173

Abstract:
In one embodiment, a packet switching device sends packets to be sent from a single link of a bundled link interface to multiple egress network processing units (on a same or different line cards). A single one of these multiple egress network processing units is configured to be in the active mode sending particular sets of packets. The other egress network processing units are configured for these particular sets of packets to be in the non-active mode, and hence, will correspondingly drop these particular sets of packets. In case of failure, an egress network processing unit can quickly (e.g., changing a flag) be changed to the active mode to quickly reduce or eliminate loss of packets.
Public/Granted literature
- US20130142036A1 Fast Repair of a Bundled Link Interface Using Packet Replication Public/Granted day:2013-06-06
Information query