Invention Grant
- Patent Title: Motion analysis through geometry correction and warping
- Patent Title (中): 运动分析通过几何校正和翘曲
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Application No.: US13584887Application Date: 2012-08-14
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Publication No.: US08885884B2Publication Date: 2014-11-11
- Inventor: Yakup Genc , Gang Li , Clifford Hatcher, Jr.
- Applicant: Yakup Genc , Gang Li , Clifford Hatcher, Jr.
- Applicant Address: US NJ Iselin US FL Orlando
- Assignee: Siemens Corporation,Siemens Energy, Inc.
- Current Assignee: Siemens Corporation,Siemens Energy, Inc.
- Current Assignee Address: US NJ Iselin US FL Orlando
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06T7/20

Abstract:
An object in a hot atmosphere with a temperature greater than 400 F in a gas turbine moves in a 3D space. The movement may include a vibrational movement. The movement includes a rotational movement about an axis and a translational movement along the axis. Images of the object are recorded with a camera, which may be a high-speed camera. The object is provided with a pattern that is tracked in images. Warpings of sub-patches in a reference image of the object are determined to form standard format warped areas. The warpings are applied piece-wise to areas in following images to create corrected images. Standard tracking such as SSD tracking is applied to the piece-wise corrected images to determine a movement of the object. The image correction and object tracking are performed by a processor.
Public/Granted literature
- US20130070967A1 MOTION ANALYSIS THROUGH GEOMETRY CORRECTION AND WARPING Public/Granted day:2013-03-21
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