Invention Grant
- Patent Title: Optical communication module
- Patent Title (中): 光通信模块
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Application No.: US13809709Application Date: 2011-07-14
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Publication No.: US08885990B2Publication Date: 2014-11-11
- Inventor: Hiroki Kawai
- Applicant: Hiroki Kawai
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-160211 20100715
- International Application: PCT/JP2011/066101 WO 20110714
- International Announcement: WO2012/008530 WO 20120119
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/42 ; H01S5/022

Abstract:
Provided is a compact optical communication module which is configured and structured so as to be suitable for high-speed transmission and which facilitates the fixing and positioning of optical elements and prevents misalignment of the optical axis during temperature change. An optical communication module is constituted so as to have a transceiver circuit as the circuit substrate, a submount unit, a fiber stub as an optical connector member, and an optical fiber coupling member. The optical communication module is configured as a modular component in which the optical axis of an optical element mounted on the submount unit is roughly parallel to the mounting surface of the transceiver circuit.
Public/Granted literature
- US20130114925A1 OPTICAL COMMUNICATION MODULE Public/Granted day:2013-05-09
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